PI’s latest 6-axis alignment system for PICs and photonics wafer-probing

By Setform

The F-713 is available in one-sided and double-sided configurations

Physik Instrumente (PI) has released the F-713, an upgrade from the F-712, a 6-axis alignment system for photonic chips, wafers, and fibre arrays

The new model maintains the F-712’s hybrid mechanical design based on a hexapod/peizo-scanner combination, and incorporates a more powerful, flexible controller created to support future developments in photonics alignment technology.

The F-713 is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications.

The F-712 has been a solution for various photonics alignment tasks, including fibre array alignment, micro-optics positioning, and photonic integrated circuit testing.

The F-713 does not radically alter the system’s performance; however, the upgraded controller provides more flexibility for future enhancements, enabling:

  • Improved support for future software and hardware developments
  • Streamlined integration of third-party electronics
  • More flexible configuration options for alignment routines and integration with new systems
  • Better scalability as customer requirements evolve

For current F-712 users, the F-713 provides a streamlined upgrade path. The system’s mechanical design, software interface, and motion control architecture are consistent, allowing users to continue relying on their existing workflows. A more flexible controller makes the F-713 a practical option for future-proofing photonics alignment systems without requiring significant changes to the current setup.

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