The HyperGauge in-plane film thickness meter can achieve full-surface measurement in five seconds
Hamamatsu Photonics has developed the HyperGauge thickness measurement system C17319-11 to enhance productivity in semiconductor manufacturing processes
The new film-thickness measurement system features Hamamatsu's proprietary wavelength detection technology, “λ-Capture,” which uses a high-sensitivity camera to allow full-surface measurement of wafers up to 300nm in diameter in five seconds.
The HyperGauge In-Plane Film Thickness Meter C17319-11 has been designed for bare- and patterned-wafer inspection and can provide high resolution and enhanced measurement reproducibility to help reduce process losses and improve yield in semiconductor manufacturing.
The system can support various applications, from observing full-surface thickness distribution on irregular or ultra-thin wafers to evaluating structures on patterned wafers. It can enable efficient film-thickness inspection at each process stage once integrated into semiconductor manufacturing equipment.
Key benefits:
- Broad application range
- High resolution and reproducibility
- Process efficiency
- Proven performance
This new system can measure wafer film thickness in two dimensions by using a high-sensitivity camera. Wafer mapping is conducted simultaneously with film thickness measurement to make it easier to select measurement locations and align positions compared to point-sensor methods, and to enable rapid acquisition of the thickness distribution.
Features include:
- No moving parts to reduce the risk of particle generation
- Equipped with “λ-Capture" technology for accuracy and reproducibility
- It has detailed measurements with 0.3mm accuracy
- The thickness distribution can be acquired in five seconds
- Specific points can be easily detected to facilitate the measurement of desired wafer locations
