Optoelectronic component manufacturer Marktech Optoelectronics has expanded its multi-wavelength emitters and detector product line.
The company’s multiple-chip LED technology now supports up to nine wavelengths in a single SMT chip-on-board (CoB) package.
In COB assemblies, multiple LED dies are mounted directly on a standard FR-4 PCB, allowing tighter packing and improved thermal management. COB technology, common in illumination products, can significantly enhance emission and detection functions in sensing applications.
By combining nine wavelengths into a single board‑level module, the new device will give designers a broad spectral palette while preserving size, weight and power (SWaP) advantages. The standard option assembly consists of 365nm, 470nm, 525nm, 570nm, 630nm, 780nm, 850nm, 940nm and 1200nm chips.
Supplied with standard or customised wavelength combinations, the new compact assembly can be provided with integrated silicon, SiC and InGaAs photodiodes for monitoring or measurement applications.
The nine-wavelength devices target a wide range of applications, including non-dispersive spectroscopy, medical diagnostics, fluorescence and fluorescence microscopy, colorimetry and water quality analysers, wearable and biomedical devices, and industrial and scientific sensing.
In terms of design advantages, Marktech’s multi-chip products offer broad spectral coverage and higher optical power output at specific wavelengths. Chips are individually addressable and assembled in compact, hermetic packaging.
Multi-length wavelength LEDs provide the required spectral lines without moving parts, reducing size, cost and warm-up time. Additionally, co-packaged LEDs operate at lower currents and emit less heat than halogen, xenon or mercury vapour sources.
Marktech’s existing multi‑chip products combine several LED dies – from ultraviolet through mid‑wave infrared – into a single package. Each chip is individually addressable, allowing designers to select wavelengths from 235nm to 4.3µm in one device.
By co‑packaging emitters and detectors, Marktech can provide complete transmitter–receiver assemblies that eliminate the need for discrete photodiodes and simplify system design of reflective analytical sensors.
Packaging options include surface‑mount, TO‑can, transfer-moulded, and the company’s ATLAS hermetic SMD package.
In IR and UV applications, two photodiodes can be incorporated into the assembly, one for monitoring the output of the invisible LEDs and a second walled detector to measure the reflective absorption of a chemical analyte, biomarker, or material constituent.
For demanding applications, Marktech also offers co‑packaged multi‑wavelength emitters with InGaAs detectors. The recently introduced MTMD1479PD6T38 and MTMD34679PD6T38 combine three to five SWIR LED chips (e.g. 1300nm through 1900nm) with a 2.6µm InGaAs photodiode, providing 800–2600nm responsivity.
