The new innovation is set to ‘revolutionise’ NFC connectivity
Semiconductor technology manufacturer and developer Pragmatic Semiconductor has launched its latest radio frequency identification (RFID) near-field communication (NFC) product range.
David Moore, chief executive officer at Pragmatic Semiconductor, said: "Pragmatic's FlexIC technology sustainably bridges our physical and digital worlds to enable low carbon, low-cost edge and item-level intelligence at scale, where it simply wasn't possible previously.”
NFC Connect looks to create seamless, item-level intelligence for mass-market products, changing the way NFC has previously functioned. This has been limited in the past due to cost constraints, supply chain problems, and sustainability challenges.
Moore added: "Our NFC Connect product line empowers sustainable customer innovation, enabling brands to unlock richer consumer experiences and drive deeper connections, from customer loyalty programs, product authentication and provenance, to facilitating improved reuse and recycling for a more circular economy. We see tremendous market demand in fast-moving consumer goods – such as food and beverage, apparel, pharmaceuticals and cosmetics – with applications rapidly extending to smart health and wellness devices, toys and games, and food freshness detection."
FlexIC, the flexible integrated circuit, is part of Pragmatic’s technology portfolio and enables NFC Connect to deliver industry-standard NFC endpoint capabilities. This can be performed in a very thin and flexible form factor, with the additional benefit of having a low carbon footprint.
James Davey, SVP sales, business development, and product management at Pragmatic Semiconductor said: "NFC Connect conforms with ISO15693 and NFC Forum Type 5 industry standards, and is easily integrated into existing workflows, providing inlay, assembly and converter ecosystem partners with a unique opportunity to expand their product portfolios while addressing new market opportunities.
Benefits of the new technology are applicable to inlay manufacturers, label converters, and service bureaus who can now integrate the new NFC technology into its packaging and products to improve functionality. Curved surfaces are now no longer a limitation, providing a smarter, more connected design with improved levels of consumer engagement at scale.
Davey added: "With an industry-leading low carbon footprint and passively powered, it offers NFC-enabled iOS and Android smartphone compatibility, enabling use within existing reader infrastructure. It can be assembled onto single-sided NFC RFID antennas, giving our customers the ability to develop thinner, more cost-effective and more sustainable NFC solutions."
Francisco Melo, president of Solutions Group at Avery Dennison, said: "Innovation is the lifeblood of our industry. It is also key to realizing item-level intelligence at scale and extending unique item-level ID to new segments, such as FMCG. It's exciting to see the launch of Pragmatic NFC Connect and to be part of this journey, I look forward to our continued strategic partnership enabling clients to pursue exciting new market opportunities."
Manufacturing takes place at the company's facility in Pragmatic Park, Co. Durham, England, which is the flagship production facility. It is home to the UK’s first 300mm semiconductor fabrication line, enabling the production of billions of chips per year using its new process.
Hector Gomez, VP of NFC Business Development at Tageos, said: "We celebrate the launch of Pragmatic NFC Connect and are delighted to explore how we can integrate the technology into our future portfolio. It is also further confirmation of our joint ambition and leadership in meeting the latest customer and market needs and in expanding and shaping the range and flexibility of new products and applications for RFID and NFC innovations."
Pragmatic Park’s innovative fabrication process delivers a sustainable rapid cycle time whilst being cost-effective. The Park consumes less energy and water in production whilst using less harmful chemicals compared to standard semiconductor manufacturers. This drives down the environmental impact of the site.
