The acquisition will bring AI-based metrology solutions to Siemens
Siemens has acquired Canopus AI, an innovator in computational and AI-driven metrology solutions that enable semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes
This acquisition expands Siemens’ semiconductor design and manufacturing digital thread by integrating additional metrology technologies, enhanced with advanced AI capabilities.
The semiconductor industry is faced with increasingly complex manufacturing challenges as device geometries continue to shrink and production volumes scale. Massive metrology has become essential to ensuring quality and yield in advanced semiconductor fabrication.
Canopus AI’s AI-powered solutions complement Siemens’ existing portfolio, providing semiconductor manufacturers with intelligent inspection and measurement capabilities that increase operational excellence.
Tony Hemmelgarn, president and CEO, Siemens Digital Industry Software, said, “The acquisition of Canopus AI exemplifies Siemens' commitment to leveraging industrial AI to solve critical challenges in semiconductor manufacturing. By combining the computational lithography and manufacturing physics simulation capability in our Calibre portfolio with Canopus AI’s advanced metrology and inspection technologies, we are creating a differentiated, end-to-end EDA digital thread that improves the fidelity of printed wafer patterns, accelerates yield ramp and reduces time-to-volume for advanced nodes. This integration further advances our vision of a comprehensive, high-accuracy, semiconductor manufacturing digital twin, enabling sub-nanometer process control and mask development.”
Canopus AI, founded in 2021 and based in Grenoble, France, is a fast-growing software and AI company dedicated to advancing wafer and mask metrology and inspection. Canopus AI is pioneering ‘Metrospection’, an approach that enhances metrology and inspection workflows with AI. Bridging the gap between conventional wafer metrology and inspection enables this software framework to use AI to help chip designers and manufacturers to meet the precision requirements of advanced technology nodes.
Joël Alanis, chief executive officer, Canopus AI, said, “We are delighted to join Siemens and bring the power of AI-enabled metrology in the semiconductor industry to a broader audience as part of Siemens’ EDA community of users. Together, we’ll empower innovators pushing the boundaries of semiconductor design and manufacturing with robust wafer and mask metrology and inspection and help them to meet the challenges of the rapidly changing semiconductor industry.”
