TI has debuted new design resources and power-management chips
Texas Instruments (TI) has debuted new design resources and power-management chips to help companies fulfil the growing demands of AI computing and scale power-management architectures from 12V to 48V to 800VDC. The new solutions will be displayed at the Open Compute Summit (OCP) on October 13 to 16 in San Jose, California
The display includes:
A white paper, titled 'Power delivery trade-offs when preparing for the next wave of AI computing growth', TI is collaborating with Nvidia in developing power-management devices to support VDC power architecture, as IT power is predicted to eclipse 1MW in the next couple of years.
A 30kW AI server power-supply unit for supporting stringent AI workloads, TI's dual-stage power-supply reference design includes a three-phase, three-level flying-capacitor power-factor correction converter paired with dual delta-delta three-phase inductor-inductor-capacitor converters. The power supply can be configured with a single 800V output or separate output supplies.
The dual-phase smart power stage, TI's CSD965203B, provides 100A of peak current per phase and combines two power phases in a 5 mm by 5 mm quad flat no-lead package. The device allows designers to increase the phase power count and power delivery over a small printed circuit board area.
The dual-phase intelligent power module for lateral power delivery, the CSDM65295 module supplies 180A of peak output current in a 9mm by 10mm by 5mm package, aiding engineers to increase data centre power density without compromising thermal management. The module combines two power stages and two inductors with trans-inductor voltage regulation (TLVR) options.
Gallium-nitride intermediate bus converter, capable of providing 1.6kW of output power in a quarter-brick form factor, TI's LMM104RM0 converter module offers over 97.5% input-to-output power-conversion efficiency and high-load efficiency, enabling active current sharing between various modules.
Why this matters
AI data centres need architectures that incorporate multiple foundational semiconductors for efficient power management, sensing and data conversion. TI is working with data centre designers to implement a comprehensive approach to drive efficient, safe power management, from power generation at the grid to the logic gates of graphics processing units (GPUs).
Chris Suchoski, sector general manager, Data Centres at TI, said, “With the growth of AI, data centres are evolving from simple server rooms to highly sophisticated power infrastructure hubs. Scalable power infrastructure and increased power efficiency are essential to meet these demands and drive future innovation. With devices from TI, designers can build innovative, next-generation solutions that are enabling the transition to 800 VDC."
