Company set out its designs at this years show
Toshina Electronics Europe to introduce new technology to enable engineers to meet system efficiency and sustainability design goals at PCIM 2025. Toshiba showcased its new range of semiconductor solutions for use in key application areas, such as e-mobility, industrial, energy, and infrastructure.
Three demonstrations areas where set out at Toshiba’s stand, with a focus on the latest innovation of wide-bandgap (WBG) technology. This makes advances for the next generation of Silicon Mosfet and Motor Control related applications.
Armin Derpmanns, VP marketing and operations at Toshiba, said: “Excellence in power, over its 150-year history, this is what Toshiba stands for. Innovative technologies and solutions, highest quality levels, and low-carbon footprint products support engineers in enhancing performance, reliability, and sustainability to build an all-electric society.”
Further updates on the company's new advancements in 6-inch silicon carbide (SiC), along with 8-inch and 12-inch silicon (Si) wafer production, are due to be shared soon. Pairing this, examples of new IGBT/FRD, RC-IGBT and SiC Mosfet dies will be introduced, and samples of a 2-in-1 SiC module with pin fin cooler will be displayed. Visitors to the stand will have a first-hand experience of mock-ups of the new 1200V/350A middle voltage mutli-chip package (MV-MCP) featuring double-sided heat dissipation, designed for xEV traction inverter applications.
Toshiba’s SmartMCD will be on display at their stand, featuring an integrated microcontroller with a gate driver. This provides higher efficiency for automotive motor applications, leading to cost savings due to space reduction.
In its industrial area, a new cordless power tool will be demonstrated, showcasing Toshiba’s three-phase brushless DC (BLDC) motor drive circuit and how it allows for compact and efficient motor control.
A specialist will be on hand to explain how the new Click boards work. This will involve a demonstration on evaluation and prototyping boards, with Toshiba highlighting its partnership with Mikroe in this field to show how they can simplify the design process for engineers in the automotive and industrial motor control sector.
The Clicker 4 Inverter Shield 2 extension board is the latest addition to the range and is capable of enabling the precise and reliable control of BLDC motors for electric power steering (EPS), powered brakes, and pumps.
xEV interter designers may be interested in Toshibas presentation taking place on the Bruessel 1 stage, 6th of May from 11:20 to 11:40 titled: ‘Impact of SBD embedding into SiC MOSFETs on dynamic behaviour at High Temperature’. Meanwhile, those interested in power electronics and semiconductors may be interested in the speech titled: ‘Accurate IGBT Circuit Model Considering Impact of Dynamic Avalanche Phenomenon’ taking place during the Modelling and Simulations two sessions, May 8th, running from 11:15 to 12:45
