Coiled assemblies

By Setform

ResilientFlex targeted for complex, small and lightweight applications

The ResilientFlex coiled assembly supports high speed signal transmission applications (such as SATA, SAS, etc) which require flexible, expandable packaging for high-signal frequencies demanding tight impedance control and 12.0 Gbps data rates and beyond.

The ResilientFlex coiled assembly, from Molex Incorporated, is based on technology that enables hot-swapping connections in removable-media applications, such as hot-swapping within storage drawers.

The Molex ResilientFlex coiled assembly can be implemented in both self-coiling flex circuit assembly or mechanically assisted coiling features that can extend electrical-connection lengths up to 558.80mm (22.00-in) beyond the installed length.

The ResilientFlex coiled assembly can be terminated with either Molex connectors, such as backplane and board-to-board connectors, or interposers— any Z-axis compression connection that has a separable interface to the flex and PCB. 

The Molex ResilientFlex coiled assembly has several key features and benefits, including:

* A self-coiling technology design that eliminates the need for additional coiling hardware, or additional options for mechanically assisted coiling hardware customized to meet application requirements:

* Ability to connect to high-speed connectors, such as backplane and board-to-board connectors, so it supports tight impedance control and data rates of 6.0 Gbps, 12.0 Gbps, and beyond;

* A 28-in overall flat, flex length that provides up to 22-in (558.80mm) connection-extension lengths;

* Termination with any Molex high-speed connector, meaning it can be used in multiple removable-media applications, hot-swapping within storage drawers;

* Termination with any interposer, regardless of the number of positions or pitch, so it provides a low-profile, 0.80mm (0.031-in) pitch, low-loss connection.

The Molex ResilientFlex coiled assembly is part of the line of copper flex products—also known as flexible printed circuits—which are designed to be ultra-reliable packaging technology. They are targeted for complex, small and lightweight applications, as well as harsh environments.

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