Crealights has established a long-term, in-depth strategic collaboration with GlobalFoundries (GF), a global semiconductor manufacturer
Utilising GF’s silicon photonics technology, Crealights will advance the engineering deployment and mass production of its 6.4T Near-Package Optic (NPO) products, advancing the industrialisation of next-generation AI silicon photonic interconnect technologies.
This move will enable Crealights to consolidate its domestic market position while continuing to expand its footprint in North America and its global business landscape, marking a new phase in the company’s global commercialisation journey.
Global AI computing clusters are evolving from horizontal scaling (Scale-out) to vertical scaling (Scale-up). As 10,000-card-scale hyperscale data centres demand higher bandwidth density, power efficiency, and lower latency, NPO and Co-packaged Optics (CPO) have become mainstream solutions for next-generation AI interconnect bottlenecks.
By integrating and packaging the optical engine adjacent to the compute chip, these technologies shorten the optoelectronic signal transmission path. Supported by its comprehensive, mature full-stack silicon photonic technology moat in NPO and CPO, Crealights has led the launch of 3.2T and 6.4T NPO optical engine products, demonstrating a strong technological advantage in next-generation high-speed AI interconnects.
To solidify the technological foundation for high-density optical interconnects in next-generation AI systems, Crealights has entered into a partnership with GF. By integrating GF’s silicon photonics platform with SCALE CPO solutions, Crealights continues to build a comprehensive advantage by combining photonic integration, high-performance RF CMOS, advanced optical devices, and fibre-optic connectivity.
Crealights is currently collaborating with GF to establish a broad ecosystem of partners spanning design, packaging, connectivity, and system layers, supporting the deployment and implementation of diverse next-generation optical architectures.
By utilising GF’s scalable global manufacturing footprint and high-volume production capabilities, Crealights has established a dual-track global manufacturing system that operates in parallel domestically and internationally.
By efficiently combining capacity at home and abroad, this alliance has shortened the R&D cycle for next-generation optical interconnect products and achieved end-to-end integration across the entire chain, including local chip design and scaled delivery for customers in North America and worldwide.
Together, they are paving a clear path from technology development to large-scale commercialisation, addressing the increasingly urgent demand for optical connectivity in AI computing clusters and hyperscale data centres.
A spokesperson for Crealights said, “Having consolidated our position in the domestic AI computing infrastructure market, Crealights is now driving its global expansion with core NPO and CPO technologies. Adding GF’s global manufacturing network and silicon photonics process technology to our current silicon photonics ecosystem ensures a stable supply of next-generation silicon photonic products and completes the commercial closed-loop from local R&D to global delivery, continuously providing core interconnect solutions for large-scale AI computing clusters worldwide.”
Thomas Barber, vice president of Communications Infrastructure and Data Centre End Markets at GlobalFoundries, said “Crealights’ comprehensive full-stack silicon photonic design capabilities are highly aligned with GF’s strengths in scaled wafer manufacturing. Through global capacity synergy and advanced packaging technology empowerment, both parties will drive the large-scale market deployment of Crealights’ products in North America and globally, jointly promoting the widespread application of silicon photonic technology in global AI computing infrastructure.”
