The power modules come in six variants and deliver high power density, and simplify system integration
Microchip Technology has launched new DualPack 3 (DP3) power modules featuring IGBT7 technology available in six variants at 1200V and 1700V with high-current ranging from 300-900A
The latest IGBT7 technology, featured in the new power modules, is engineered to minimise power losses by 15-20% in comparison to IGBT4 devices, and operates at higher temperatures up to 175°C during overload.
DP3 modules help to protect and control during high-voltage switching, meaning they are capable of enhancing power density, reliability and ease of use in industrial drives, renewables, traction, energy storage and agricultural vehicles.
Available in a phase-leg configuration, the power modules in a compact footprint of 152mm x 62mm x 20mm enable a frame size jump for increased power output.
This type of power packaging removes the requirement for paralleling multiple modules and reduces system complexity and Bill of Materials (BOM) costs. The DP3 modules also have a second-source option to industry-standard EconoDual packages for improved flexibility and supply chain security for customers.
Leon Gross, corporate vice president of Microchip’s high-reliability and RF business unit, said, “Our new DualPack 3 modules with IGBT7 technology can reduce design complexity and lower system costs while maintaining high performance. To further streamline the design process, our power modules can be integrated as part of a comprehensive system solution alongside Microchip’s microcontrollers, microprocessors, security, connectivity and other components to accelerate development and time to market.”
The DP3 power modules are designed for general-purpose motor drive applications to combat challenges, including dv/dt, complexity in driving, higher conduction losses, and no overload capability.
