Microchip unveils new high-density power module

By Setform

The new module is designed for AI usage

Microchip Technology has unveiled its new MCPF1412, a fully integrated point-of-load 12A power module with a 16V VIN buck converter and support for I2C and PMBus® interfaces. This development is important for AI, which is demanding more integration and power consumption, being an important module for advanced power management solutions and data centre applications.  

Designed to provide improved performance and reliability, the MCPF1412 provides efficient power conversion and reduced energy loss. It is held in a 5.8 mm × 4.9 mm × 1.6 mm and innovative Land Grid Array (LDA) package, reducing board space requirements by over 40% when compared to other discrete solutions. It also minimises sound when switching between PCB and RF.

Rudy Jaramillo, vice president of Microchip’s analogue power interface division, said: “The MCPF1412 is highly compatible with our FPGAS and PCIe® solutions, providing a comprehensive solution for Microchip customers. This innovative solution minimises space usage by reducing chip placements when combined with other Microchip devices.”

Both I2C and PMBus interfaces are compatible with the module due to its flexible design. It can monitor systems using these interfaces, whilst also being able to be used in standalone operation without a digital interface. Designers can configure output voltages using simple resistor divider adjustments and monitor the system via the Power Good output.

The module also features multiple diagnostic functions, including over-temperature, over-current, and over-voltage protection, helping improve both performance and reliability. Its temperature usage range is TJ −40°C to +125°C, and an on-board embedded EEPROM can program the default power-up configuration. 

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