New relays enable denser board designs
Omron Electronic Components Europe, an industrial automation and electronic components provider, has released its new G3VM S-VSON(L) MOS FET relay. The relay is designed for use in semiconductor test equipment, communication equipment, and test and measurement equipment.
The relay is suitable for use in temperatures up to 125˚C, which is a 15˚C increase from the previous rendition, which was limited to ambient temperatures of 110˚C. The device is voltage-driven and does not require a side resistor input selection, thereby creating more space on the board.
As technology advances, applications are becoming smaller and more complex. This prompts designers to find new ways and methods to fit more components onto each board. The issue with this is each component generates heat whilst being used, potentially impacting efficiency and reliability.
Because of this, temperature performance has been improved in the G3VM relays and allows for the design of more densely packed boards. This means when being deployed in test applications, more tests can be conducted at the same time, and in a shorter amount of time.
Better temperature performance also allows the relay to have smaller application designs, with the G3VM capable of withstanding higher amounts of heat dissipation without loss in efficiency.
The relay weighs in at 0.1g, whilst measuring at 2.0mm in length, 1.45mm in depth, and 1.3mm in height. The relay is available in four different versions, with inputs ranging from 0.54mA up to 6.6mA. A continuous load current ranging from 0.4A to 1.5A options are available as well.
