Parker Chomerics launches thermal grease series for applications needing thin bond lines
Thermal conductivity up to 7.0 W/m-K at minimum bond lines of 0.025…
Parker launches high-performance thermal gap filler with ultra-low hardness
The filler pads are suitable for applications where high performance ultra-low shore…
New dispensable thermal gel from Parker Hannifin’s Chomerics Division
The dispensable thermal gel has 7.5W/m-K typical thermal conductivity
New gap filler pad
Delivering superior thermal conductivity and performance and offers ultra-soft conformability to combat…
Touchscreen LCDs reduce time to market for rugged equipment
CHO-TOUC range from Chomerics benefits OEMs in industrial, medical, aerospace and other…
