Thermal conductivity up to 7.0 W/m-K at minimum bond lines of 0.025 mm
The Chomerics Division of Parker Hannifin Corporation, a specialist in motion and control technologies, has launched its new high-performance thermal grease series
Therm-a-Grease is an advanced paste with a thermally conductive filler material that can draw away heat generated by circuit board components while filling thin bond lines.
The series includes four silicon-based greases with varying thermal conductivities to deliver efficient heat dissipation in electronic applications. The grease's thermal conductivities are:
- Therm-a-Grease 15: 1.5W/m-K
- Therm-a-Grease 30: 3.0W/m-K
- Therm-a-Grease 50: 5.0W/m-K
- Therm-a-Grease 70: 7.0W/m-K
The minimum bond line of 0.035mm ensures the products are suitable for applications with manufacturing and assembly tolerances. Therm-a-Grease operates effectively at low pressure, performing heat transfer tasks involving delicate or densely packed printed circuit board (PCB) components.
Therm-a-Grease 15 and Therm-a-Grease 30 also feature a low thermal impedance of 0.097°C-cm²/W at 2.75 bar and 0.084°C-cm²/W at 6.89 bar, at the minimum bond-line thickness of 0.025mm.
Therm-a-Grease 50 provides a thermal impedance of 0.084°C-cm²/W at 2.75 bar and 0.071°C-cm²/W at 6.89 bar, while Therm-a-Grease 70 offers 0.065°C-cm²/W at 2.75 bar and 0.045°C-cm²/W at 6.89 bar.
The new thermal greases require only low compression force, deflecting under assembly pressure to reduce stress on components, soldered joints and PCB leads. This ensures user convenience by supporting the easy application of Therm-a-Grease via stencilling, screen printing, or dispensing. The absence of any requirements for mixing, curing, or refrigeration simplifies application and storage, and repair rework is straightforward.
A rigorous test regime enables Therm-a-Grease to provide reliable thermal management, even in extreme environments. The products withstand thermal cycling, long-term heat ageing, and high-humidity conditions, delivering stability without pumping out or hardening/cracking over time. These attributes are suitable for applications ranging from CPUs, GPUs, and memory modules in the computing sector to power supplies, power conversion equipment, lighting, and automotive control modules.
