Micro-Epsilon is highlighting non-contact measurement technologies designed to provide real-time quality control in two demanding manufacturing applications: superconducting strip production and semiconductor hybrid bonding.
In the production of superconducting strips for power applications, stainless steel strips approximately 12mm wide are processed with a nickel alloy before being divided into narrow segments. Typical configurations include 3 or 4mm-wide partial strips separated by gaps of just 0.5mm. Because the strips can also carry sensitive PVD coatings, dimensional inspection must avoid physical contact while maintaining high measurement precision.
Micro-Epsilon’s optoCONTROL 2700-40 LED micrometre measures the strip immediately after cutting while the material remains in motion. Its Multi-segment function measures both the overall 12mm strip width and individual partial-strip dimensions, while also detecting the narrow gaps between segments.
Measurement data is transmitted to the production control system in real time, allowing deviations to be identified and corrected during processing rather than during subsequent inspection.
The optical micrometre provides a resolution of 10nm and repeatability of ≤0.1μm. A measurement rate of 5kHz enables continuous monitoring of moving strips, supporting rapid detection of dimensional deviations and helping reduce material waste. Interfaces including EtherCAT, PROFINET, Ethernet/IP and analogue signals allow integration with existing cutting and production equipment.
The non-contact measurement principle also protects nickel and PVD layers from mechanical damage, avoiding scratches or deformation during inspection.
Micro-Epsilon is also applying capacitive distance sensing to hybrid bonding, where wafer planarity is critical to achieving reliable semiconductor bonding. The technology is applicable to die-to-wafer (D2W) and wafer-to-wafer (W2W) processes, in which copper contact surfaces are joined directly without conventional solder balls.
Capacitive sensors can measure wafer shape deviations such as deflection, twisting and local warping without contacting the surface. Sensor arrays can scan upper and lower wafers to identify local height variations, inclinations and overall deflection.
The resulting measurement data can then be used for active correction of wafer positioning. Where height differences are detected, bonding equipment can adjust the Z-axis using piezo-actuators or precision axes. For small dies, segmented chuck surfaces can also be levelled locally.
The sensors’ vacuum-compatible design allows them to operate across a broad range of semiconductor processing environments, providing measurement data for adaptive levelling before bonding.
Together, the two applications demonstrate how high-speed, non-contact metrology can provide closed-loop process control while protecting sensitive materials and components.
