Texas Instruments (TI) has introduced two industrial communication devices designed to simplify connectivity across factory automation, robotics and Industrial Internet of Things (IIoT) systems.
The TICS100MOD multiprotocol system-on-module (SoM) and TIOM2212 dual-channel IO-Link master aim to reduce integration complexity while supporting flexible industrial networking architectures.
The TICS100MOD is built around TI’s AM2612 microcontroller (MCU) and DP83826AI Ethernet physical layer. It integrates two Arm Cortex-R5F cores and external memory to support fully featured industrial protocol stacks in a compact design. The module supports EtherCAT, EtherNet/IP and Profinet, allowing engineers to switch protocols at boot time through firmware updates rather than redesigning hardware.
TI describes it as the industry’s smallest fully featured, certified multiprotocol communications SoM. Its approach is intended to reduce the need for separate hardware platforms for different Industrial Ethernet protocols, helping manufacturers accommodate changing customer and regional requirements.
“Industrial communication is evolving faster than ever, and engineers need a partner who can help them adapt to emerging standards and requirements,” said Karim Jamal, director of industrial communications solutions at TI.
“TI brings together certified hardware, software and in-house engineering expertise, supporting customers as they develop next-generation industrial automation systems that work together seamlessly across devices, networks and communication protocols.”
Connecting field devices
Complementing the SoM, the TIOM2212 provides two IO-Link master channels to connect sensors and actuators with higher-level Industrial Ethernet networks. Advanced analogue integration and built-in protection features are intended to support reliable data exchange at the field-device level.
The device is compatible with TI’s Sitara industrial networking SoCs and AM13Ex real-time MCUs through an integrated frame handler, providing a route to simplify the connection between field devices and factory control systems.
“At SICK, we rely on robust and future-ready communication technologies to connect sensors, machines, and systems. TI’s Industrial Ethernet and IO-Link solutions help us bring products such as the SIG300 to market with the performance and reliability required for modern industrial automation,” said Dr. Stefan Odermatt, senior vice president of research and development, integrated automation at SICK.
Supporting flexible network architectures
TI’s wider multiprotocol portfolio combines programmable hardware with certified, production-ready software stacks, evaluation modules and development tools. Its PRU-ICSS architecture handles deterministic, low-latency communications, freeing general-purpose Arm cores for other processing tasks.
Preproduction quantities of the TIOM2212 are available now, while the TICS100MOD is expected by the end of 2026. TI will demonstrate its multiprotocol technology at electronica 2026 in Munich, Hall C4, Booth 159.
