A-Gas Electronic Materials adds grayscale lithography to portfolio

Image via Micro Resist Technology

A-Gas Electronic Materials, a specialist supplier of advanced materials and process expertise for electronics and semiconductor manufacturing, is expanding its portfolio with mr-P 22G, a positive-tone grayscale photoresist from Micro Resist Technology

As demand grows across micro-optics, MEMS and advanced surface engineering, traditional lithography approaches are being stretched. Developed around binary exposure, they can limit how efficiently engineers create depth and profile, often needing several process steps to achieve the desired result.

Grayscale lithography enables controlled variation in exposure and development, allowing engineers to define height, depth, and surface profile within a single resist layer. The result is more design freedom, fewer process stages, and enhanced efficiency in applications where geometry influences performance.

Despite this, adoption has remained limited, often due to uncertainty around how grayscale behaves in practice and where it adds the most value.

Dr David Shaw, business manager at A-Gas Electronic Materials, said, “Grayscale lithography isn’t just about what’s possible; it’s about what’s practical. Our role is to help customers understand where it fits, how it behaves in real processes, and how to apply it with confidence.”

me-P 22G can support advanced 3D microfabrication, enabling ultra-thick-film applications and deep, high-resolution patterning in a single process step. This makes it suitable for applications such as micro-optics, MEMS and MOEMS, where precise surface geometry is critical to performance.

With a limited number of true grayscale resists available, this approach offers engineers a practical way to move beyond conventional lithography constraints and explore more complex structures.

A-Gas Electronic Materials is supporting adoption through material selection, process guidance and technical troubleshooting, enabling customers to bridge the gap between material capability and real-world process performance.

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