Littelfuse/C&K launches new SDE Series low-profile end-stackable surface-mount DIP switches

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Littelfuse, an industrial technology manufacturing company, has launched the Littelfuse/C&K SDA Series, a low-profile, end-stackable surface-mount DIP switch family engineered to provide space-saving flexibility in compact, space-limited designs

Industrial control panels, security and fire systems, and IoT devices increasingly require configurable switch banks that fit into tighter board space. Many conventional DIP switch packages fix the position count and complicate automated assembly and washable board processing.

The SDE Series addresses this challenge with a modular, end-stackable architecture that enables designers to expand switch positions within a standard 0.1” integrated circuit pitch, supporting scalable configurations without redesigning the printed circuit board.

The SDE Series includes copper alloy contacts with gold plate over nickel plate for consistent, reliable switching performance, and a top-tape-sealed construction that supports automated surface-mount insertion and washable processing. All plastics used in the series are UL 94V-0 grade fire retardant, and the switches are RoHS compliant and halogen-free.

With a contact rating of 24V DC, 25mA (switching) and 100mA (non-switching), and a mechanical and electrical life of 1,000 cycles, the SDE Series supports reliable, repeatable configuration settings across a range of low-power control applications. Available in up to 12 positions, the switches are supplied in tube or tape-and-reel packaging to support high-volume production environments.

Jesus Santos, global product manager at Littelfuse, said, “When design flexibility and space optimization are critical, customers need more than a standard DIP switch. The SDE Series addresses these challenges with its unique end-stackable architecture, allowing engineers to easily scale and reconfigure their designs without increasing PCB footprint. Combined with its low-profile design, gold-plated contacts, and process-ready sealing, the SDE Series helps customers improve reliability, simplify manufacturing, and reduce development time in today’s compact and high-density applications.”

The SDE Series delivers:

  • Space-saving flexibility enabling easy configuration expansion in space-limited designs
  • End-stackable design with a standard 0.1″ integrated circuit pitch
  • Reliable switching performance with copper alloy contacts, gold plate over nickel plate
  • Molded 0.3″ integrated circuit packing outline allowing automatic insertion
  • Top tape sealed to enable washable processing
  • Fire-safe construction with all plastics UL 94V-0 grade fire retardant
  • RoHS compliant and halogen-free for acceptance in worldwide markets

The new DIP switches provide flexibility, reliability, and safety in a compact package designed for automated assembly.

The SDE Series is well-suited for:

  • Industrial control electronics in industrial systems
  • Garage door systems and controls in building automation systems
  • Security and fire alarm systems
  • IoT devices for consumer electronics

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