Inspection, metrology and testing technology provider Nordson Test & Inspection will debut its new SonoFlex Acoustic Microscopy Inspection (AMI) System at Semicon West next month.
On display at booth 5844 from 13-15 October, the platform is designed to redefine acoustic inspection performance for back-end advanced semiconductor manufacturing.
The system combines breakthrough ThruScan imaging technology with AI-powered analytics, delivering exceptional image quality, highly accurate defect detection, and significantly increased throughput for small-panel applications.
Incorporating advanced pulser and transducer technologies, SonoFlex enables scanning speeds up to twice as fast as conventional solutions, while maintaining high-resolution imaging performance.
Its modular architecture simplifies maintenance and serviceability while enabling scalable multi-system configurations capable of increasing throughput by up to eight times.
Powered by FlexCore software and Nordson’s N-Intelligence Multi-Gate Image Analysis (MGIA) technology, SonoFlex automatically identifies defects, isolates true void counts, and supports complex device and process analysis. The result is improved product quality, greater manufacturing efficiency, and deeper process insight through advanced acoustic inspection and imaging capabilities.
In addition to SonoFlex, Nordson will showcase a broad range of advanced inspection and metrology solutions at Semicon, each designed to enhance yield, process control, and productivity across front-end, mid-end, and back-end semiconductor manufacturing operations.
These include the company’s SQ7000+ platform, which delivers high-speed, high-accuracy inspection and metrology with ultra-high-resolution Multi-Reflection Suppression (MRS) sensor technology. Also on display will be Nordson’s SQ3000 M2 platform, designed specifically for microelectronics applications such as wire bond inspection.
Nordson will also demonstrate Dynamic Planar CT, which the company says forms the next generation of 3D planar X-ray technology for its automated X-ray inspection (AXI) systems, alongside the Quadra 7 Pro which it claims establishes a new benchmark for 2D and 3D manual X-ray inspection in semiconductor back-end manufacturing.
The company’s Gen7 AMI system for the detection of delamination, voids cracks and other internal defects will also be featured on the booth, alongside Nordson’s SpinSAM AMI system for defect detection in wafer-level and advanced packaging applications, and the XM8000Pro 3D X-ray metrology for advanced semiconductor manufacturing.
For front-end semiconductor manufacturing, the company will demonstrate its WaferSense AGS2 and ACS wireless metrology sensors for capturing and analysing real-time data for semiconductor tool set-up and maintenance. Semicon West takes place 13-15 October at the Moscone Centre in San Francisco, California.
